Layered architecture refers to a design methodology that divides the functionality of an integrated circuit (IC) into distinct layers, each responsible for a specific aspect of the design. This approach allows for better organization, abstraction, and modularity, making the design process more manageable and scalable. This also enables flexibility for design and implementation while retaining…

In the ever-evolving landscape of semiconductor design, chiplets have emerged as a revolutionary paradigm, reshaping the architecture of system-on-chip (SoC) systems. Central to this transformation is the Bunch of Wires (BoW) standard, which is redefining die-to-die interconnects with its efficiency and versatility. This article delves into the profound impact of BoW on semiconductor integration, exploring…

In the ever-evolving landscape of semiconductor design, chiplets have emerged as a revolutionary paradigm, reshaping the architecture of system-on-chip (SoC) systems. Central to this transformation is the Bunch of Wires (BoW) standard, which is redefining die-to-die interconnects with its efficiency and versatility. This article delves into the profound impact of BoW on semiconductor integration, exploring…

The BoW (Bunch of Wires) PHY layer is the physical foundation for communication between chiplets in a multi-chiplet design (ODSA) using the BoW interface. The BoW PHY layer is responsible for transmitting and receiving data signals between chiplets on the same package. The BoW PHY is defined as a single unidirectional slice. Multiple slices are…

In the ever-evolving landscape of semiconductor technology, the rise of on-chip interconnect has emerged as a pivotal advancement, revolutionizing the design and functionality of modern microchips. Understanding the Basics Advanced packaging is highly complex and involves a wide mixture of technologies, interconnection technology remains at its core. At the forefront of this transformation are chiplets…