D2D Layered Architecture
Layered architecture refers to a design methodology that divides the functionality of an integrated circuit (IC) into distinct layers, each responsible for a specific aspect of the design. This approach
Impact of BoW in Chiplet Industry
In the ever-evolving landscape of semiconductor design, chiplets have emerged as a revolutionary paradigm, reshaping the architecture of system-on-chip (SoC) systems. Central to this transformation is the Bunch of Wires
Impact of BoW in ChipletIndustry
In the ever-evolving landscape of semiconductor design, chiplets have emerged as a revolutionary paradigm, reshaping the architecture of system-on-chip (SoC) systems. Central to this transformation is the Bunch of Wires
Overview of BoW PHY
The BoW (Bunch of Wires) PHY layer is the physical foundation for communication between chiplets in a multi-chiplet design (ODSA) using the BoW interface. The BoW PHY layer is responsible
The Rise of Interconnects
In the ever-evolving landscape of semiconductor technology, the rise of on-chip interconnect has emerged as a pivotal advancement, revolutionizing the design and functionality of modern microchips. Understanding the Basics Advanced