Skip to content Skip to sidebar Skip to footer

D2D Layered Architecture

Layered architecture refers to a design methodology that divides the functionality of an integrated circuit (IC) into distinct layers, each responsible for a specific aspect of the design. This approach

Read More »

Impact of BoW in Chiplet Industry

In the ever-evolving landscape of semiconductor design, chiplets have emerged as a revolutionary paradigm, reshaping the architecture of system-on-chip (SoC) systems. Central to this transformation is the Bunch of Wires

Read More »

Impact of BoW in ChipletIndustry

In the ever-evolving landscape of semiconductor design, chiplets have emerged as a revolutionary paradigm, reshaping the architecture of system-on-chip (SoC) systems. Central to this transformation is the Bunch of Wires

Read More »

Overview of BoW PHY

The BoW (Bunch of Wires) PHY layer is the physical foundation for communication between chiplets in a multi-chiplet design (ODSA) using the BoW interface. The BoW PHY layer is responsible

Read More »

The Rise of Interconnects

In the ever-evolving landscape of semiconductor technology, the rise of on-chip interconnect has emerged as a pivotal advancement, revolutionizing the design and functionality of modern microchips. Understanding the Basics Advanced

Read More »