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The BoW (Bunch of Wires) PHY layer is the physical foundation for communication between chiplets in a multi-chiplet design (ODSA) using the BoW interface. The BoW PHY layer is responsible…

In the ever-evolving landscape of semiconductor technology, the rise of on-chip interconnect has emerged as a pivotal advancement, revolutionizing the design and functionality of modern microchips. Understanding the Basics Advanced…